| 技术规格及参数 | 1.1光刻精度：
至少支持两个光刻镜头：
光刻镜头1：最小线宽≤0.8 μm，工作距离≥9 mm；
光刻镜头2：最小线宽≤0.4 μm，工作距离≥5 mm
Lithography accuracy：
Supports at least two Lithography lenses：
Lithography lens 1：
Critical dimension≤0.8 μm，WD≥9 mm；
Lithography lens 2：
Critical dimension≤0.4 μm，WD≥5 mm
1.2 套刻指引：支持实时光刻图形的预览功能
Pattern indication wavelength：exposure preview, for alignment purpose
1.3支持激光主动对焦
Optical automatic focus function
1.4 支持光刻镜头电动切换
Lens switching module
1.5曝光波长：385±5 nm
Exposure wavelength：385±5 nm
1.6 数字掩模板分辨率：≥1920 1080
DMD resolution：≥1920 1080
1.7显微观测：支持显微观测且不会引起光刻胶变性
Microscopic observation：Supports microscopic observation without causing photoresist
denaturation
1.8 光刻镜头电动切换时间：≤300 ms；重复定位精度：≤400 nm
Supports up to Lithography lens Speed：≤300 ms；Bidirectional accuracy：≤400 nm
1.9 最大样品厚度：≥10 mm
Maximum Compatible sample thickness：≥10 mm
1.10 最大样品尺寸：≥125 mm 125 mm
Maximum Substrate dimension：≥125 mm 125 mm
1.11 样品电动旋转：电动样品旋转台，行程≥±20°，步进精度≤0.001°
Electric adjustment：Rotation stage，Range≥±20°，Accuracy≤0.001°
1.12样品吸附：支持样品吸附
Sample adsorption： Support for sample adsorption
1.13设备软件：支持阵列光刻、尺寸测量、进度显示
Software： Programmable parameter array for rapid exposure optimization、Mapping
navigation、Dimension measurement
1.14画图软件：支持阵列画图、套刻画图
Professional software for pattern pixelate： Design tools for array patterns、Design tools
for overlay patterns
1.15湿度控制：支持设备内部湿度控制
Humidity control： dehumidification device integrated
1.16软件操作界面支持中英文双语
The software operation interface supports both Chinese and English
1.171.17 防震保护要求：鉴于实验室位于三楼，中标供应商必须提供隔离解决方案，能够****实验室振动。最为重要的是，提供的隔离解决方案必须足以确保最低器件分辨率达到 400nm或者更优。
Vibration Protection Requirement: Given the lab's location on the 3rd floor, the supplier is required to furnish an isolation solution capable of effectively isolating the majority of laboratory vibrations. Of utmost importance is that the isolation solution provided must be sufficient to ensure minimum device resolution as good as 400nm |
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